MDGEL 6606 Semiconductor IGBT Transparent soft silicone potting gel

1:1 addition molding, strong viscosity
High elongation; Excellent flexibility, eliminating mechanical stress
Very low oil permeability after curing, excellent resistance to toxicity
High temperature electrical insulation is excellent, to provide protection against high pressure
Long-term use temperature range -50-220℃
Excellent aging resistance and weather resistance
Excellent waterproof, anticorrosive, moisture-proof, chemical medium resistance
It can be used in semiconductor modules, sensors, etc

Product description

MDGEL 6606 is a transparent two-component self-healing silicone gel. After curing, it forms a special soft material that is buffered and automatically recovered. It is designed to insulate circuit boards from moisture and other harmful contaminants and to provide insulation against high voltages. Another use is to provide stress relief to protect circuits and interconnectors from high temperature and mechanical

Data Sheet

	Component A	Component B
Appearance	Clear fluid	Clear fluid
Viscosity,25 ° C CPS	1000±200	1000±200
Specific gravity, g/cm3	0.99	0.99
Mix ratio	A: B = 100:100 weight ratio
Viscosity after mixing	1000±200 cps
Operating time after mixing	25℃ for 120-180 minutes
Hardening conditions	24 hours at 25℃ or 60 minutes at 80℃
Appearance	Colorless clear gel
Needle penetration,1/10 mm	75±10
Thermal conductivity, W/m.K	0.22
Dielectric strength (KV/mm)	25
Volume resistance (Ω·cm) DC500V	1.0×10¹⁵
Loss factor (1 MHz)	＜0.001
Dielectric constant (1 MHz)	2.8
Use temperature range	– 60 ∽ 260 ℃
Temperature range for long-term use	-50 ∽ 220 ℃

Application

Typical applications

Power semiconductors, electronic sensors, MEMS Top Coating, automotive ECU integrated modules and other packaging protection IC chips, undersea fiber pooping and so on.

How to use

Operation Use craft

Weigh the A and B components according to the ratio of 1:1, mix evenly, stand for debubbling or vacuum debubbling, and then inject into the components (or modules) that need to be potting protection.
The potting components can be put to rest and cured at temperature (about 60 minutes under the condition of 80 ° C), or cured directly at room temperature, about 24 hours.